Size: 1220(L)*760(W)*2000(H)
Speed of service AC220V OR AC380 V
Output speed 2200 grain/min
Dimensions : Packaging bag 132000 / Hour
Blanking film 8(Width) ,0.4(Thickness)
Upper Feed film 5.4(Width), 0.042 (Thickness)
Down Feed film 5.4(Width), 0.55 (Thickness)
chip size 0402R
heating element Temperature up to 200 degrees
Wafer implantation rate 2200 / minute
Wafer feeding unit Abnormal automatic discharge system
Upper membrane stripping force 10 to 60 Gf
Tape support With support ,Can be connected to each other
Automatic start
(1) the carrier tape and the upper and lower sealing film are indeed imported
(2) the chip is put into the funnel
(3) funnel switch (HOPPER) plate to auto
(4) P.F. switch to MANU, so that the chip runs into the material, and then P.F. to AUTO.