Platelet Calcined Alumina
Features: The crystal is similar round flake, no sharp edge, moderate hardness,
excellent toughness, uniform particle size distribution. It has high grinding
efficiency. It can get high uniform surface during the grinding process. The
workpiece surface ground by it is excellent.
Application:
Grinding and
polishing semiconductor monocrystal silicon, piezocrystal material, compound semiconductor
material, optical glass, hard glass, alloy steel, etc. It can also be used on
precision ceramics, special metal surface for precision grinding, it can be
used as the fill of special coatings and plasma spraying.
|
Grit |
W3 |
W5 |
W9 |
W12 |
W15 |
W20 |
W25 |
W30 |
W35 |
W40 |
W45 |
|
D50
(μm) |
4.7±0.4 |
6.4±0.5 |
8.2±0.6 |
10.2±0.8 |
14.2±1.1 |
17.4±1.3 |
20.8±1.5 |
25.5±1.7 |
29.7±2.0 |
34.9±2.3 |
|
|
Al2O3 |
≥99 |
≥99.1 |
≥99.2 |
≥99.3 |
≥99.4 |
≥99.5 |
|||||
|
SiO2 |
≤0.10 |
≤0.08 |
≤0.07 |
≤0.06 |
≤0.05 |
≤0.03 |
|||||
|
Fe2O3 |
≤0.10 |
≤0.08 |
≤0.07 |
≤0.06 |
≤0.05 |
≤0.04 |
|||||
|
Na2O |
≤0.8 |
≤0.7 |
≤0.4 |
≤0.4 |
≤0.4 |
≤0.35 |
|||||
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