System Features:
1.Applicable to a wide range of materials;2.Good beam quality, small focused laser spot, enabling super-fine marking;
3. Small heat-affected zone,avoiding damaging the material; high yield rate;
4.High marking speed, high efficiency and high precision;
5.No consumables are required, thereby reducing cost and maintenance expenses;
6. Overall performance is stable, suitable for continuous long-time operation;
Application
1. Marking and piercing of food packaging materials, PVC pipes and medical packaging materials (HDPE, PO, PP, etc.); piercing, with hole diameter d≤10μm.
2. Marking and slicing of flexible PCB boards.
3.Removing metal or non-metal coatings4.Processing micro-holes and blind holes of silicon wafers.