Inline PCBA AOI for soldering
Inline PCBA AOI for solder joint
To inspect the defect of solder joint after wave-soldering.
Model: AIS301 / AIS303 / AIS303-L
Principle:
It captures board image in real time by high precision color industrial camera. Adopt Convolutional Neural Network (CNN) algorithm to process images. Judge defects of components and soldering intelligently.
Core Algorithm:
By applying deep learning algorithm, big data optimization and intelligent minimalist programming in industrial inspection, MAKER-RAY enables intelligent judgment by one-click automatic identification of components and solder joints, thus addressing the two major pain points of traditional algorithms, namely, long programming time and high false alarm rate.
Application
Defect Type
Core Advantage
Minimalist programming
Quick Inspection Speed
Multiple Inspection Modes
Options
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