SMT assembly hdi double-sided multilayer flexible High frequency pcb smt pcba oem service assembly manufacturer WithProvided Gerber Files BOM PCB Techinecal Capacity | ||||||||
Layers | Mass production: 2~58 layers / Pilot run: 64 layers | |||||||
Max. Thickness | Mass production: 394mil (10mm) / Pilot run: 17.5mm | |||||||
Material | FR-4 (Standard FR4, Mid-Tg FR4,Hi-Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT,PPO, PPE, Hybrid, Partial hybrid, etc. | |||||||
Min. Width/Spacing | Inner layer: 3mil/3mil (HOZ), Outer layer: 4mil/4mil(1OZ) | |||||||
Max. Copper Thickness | UL certificated: 6.0 OZ / Pilot run: 12OZ | |||||||
Min. Hole Size | Mechanical drill: 8mil(0.2mm) Laser drill: 3mil(0.075mm) | |||||||
Max. Panel Size | 1150mm × 560mm | |||||||
Aspect Ratio | 18:1 | |||||||
Surface Finish | HASL,Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger | |||||||
Special Process | Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control |
PCBA manufacturing capability | ||||||||
Position accuracy:20 um | ||||||||
Components size:0.4×0.2mm(01005) —130×79mm,Flip-CHIP,QFP,BGA,POP | ||||||||
Max. component height::25mm | ||||||||
Max. component height::25mm | ||||||||
Min. PCB size:no limited | ||||||||
PCB thickness:0.3 to 6mm | ||||||||
PCB weight:3KG | ||||||||
Max. PCB width:450mm | ||||||||
Min. PCB width: no limited | ||||||||
Component height:Top 120mm/Bot 15mm | ||||||||
Metal type :part, whole, inlay, sidestep | ||||||||
Metal material:Copper , Aluminum | ||||||||
Surface Finish:plating Au, plating sliver , plating Sn | ||||||||
Air bladder rate:less than 20% | ||||||||
Press range:0-50KN | ||||||||
Max. PCB size:800X600mm | ||||||||
Testing | ICT,Probe flying,burn-in,function test,temperature cycling |