Introduction of main specifications and control parameters :
This laser trimming machine is dedicated to meet the needs and adjust the resistance of wafer tailored to the special equipment,The laser is a gas cooled, high efficiency, low power consumption, low maintenance cost of this machine.
Integrated laser power control ensures that the excellent performance of the constant time operating, and the production is not interrupted and the requirements of the production equipment can be improved by the pumping of the device.
The machine building visual identification system has further strengthened the accuracy of adjustment; and dual mode measurement system provides a wide range of resistance. The high speed and high precision measurement
Electric:AC220V 3Φ 50/60HZ
3.Outer size: L 1720 x W 950 x H 1665 mm
4.Control :method Adopted IPC industrial computer control mode.